Review request - mixed technology board with SM components near through-hole zones - concerned about clearances
"This is my first mixed technology board and I would genuinely appreciate experienced eyes before I send it to fab.
The board combines through-hole connectors with other SM products including decoupling capacitors and pull-up resistors clustered around the microcontroller section.
My main concern is the boundary zone where through-hole and surface mount regions meet. The through-hole connector footprints leave solder mask clearances that I want to verify are not creating problems for adjacent SM component pads. I have maintained what I believe is adequate clearance but I am not confident it is correct for wave soldering compatibility without affecting the SM assembly on the same board face.
Ground plane management under the SM cluster is my second concern. I used a solid pour with thermal relief on through-hole pads but I am uncertain whether my relief spoke width suits the connector current ratings. DRC passes cleanly but I know that and actually being sound are different things.
Someone at a local maker meetup once said that hobbyists now access component application notes through listings on alibaba that previously only reached professional procurement teams. Interesting how technical knowledge travels now.
Schematic and layout images in comments. Thank you in advance. "