r/Semiconductors

How to make sense of these? They seem so general. “Troubleshoot complex problems” “perform root cause analysis” but for what department? How do you tell if you are a strong fit or not based on the technology you have experience in?

Theres also Process Eng 2 Sr, Process Eng 3 Sr, Process Engineer NCG with 2-4 YOE required, just plain “Process Engineer” positions with 7-10 YOE, Process Engineer III with type: college student/intern listed and asking for your grad date, and the list goes on.

Just some context, I previously interned at AMD as an intern in front-end, I learnt many relevant concepts, and even went back to complete my studies with a RISC-V AI accelerator design as my undergraduate project.

And just out of nowhere, for personal reasons, I must relocate to a place to work, where landing a role in digital chip design, not even mentioning front-end roles like RTL/DV is close to impossible for fresh graduates. But luckily, I managed to land a role for ATE test engineer at Qualcomm.

I feel really luckily to even land such a role, I love the company and the work, but I just cant get it off my mind where I need to give up what I used to have passion for.

I guess I am just open to hearing what you guys think of my situation.

Got selected at Applied Materials Bangalore — C++ Developer,

Digital Lithography Group (IPC). 7+ YoE in embedded systems.

Currently at a tier-1 semiconductor company.

Current TC: ~42 LPA (26L base + stocks + bonus)

— need honest inputs:

💰 TC breakdown? (Base/Bonus/RSU) Yearly refreshers? Hikes?

🏢 WLB? WFH/hybrid? Manager culture?

📚 Promotions? Learning opportunities?

⚠️ Any red flags?

Even rough answers help. Thanks! 🙏

PS: Used AI to structure this post.

Need some genuine career advice from people in semiconductor packaging/SI-PI roles.

Right now I’m working in an OSAT-type environment where my role is kind of a mix of Advanced Package Design and SI/PI. Over the last few years I’ve worked on things like:
- Advanced package/RDL/substrate design
- High-speed routing
- SI/PI simulations and debugging
- UCIe/LPDDR/HBM related issues
- Package bring-up and coordination with different teams
- A bit of NPI exposure too

The problem is I’m now at a stage where I need to decide whether I want to go deeper into SI/PI specialization or move more toward package design + NPI/program side responsibilities.

I currently have two offers:

1. AMD
   - More SI/PI focused role
   - Feels more aligned with deep technical work in high-speed/package architecture
   - Slightly lower compensation

2. Broadcom
   - More package design + NPI focused
   - Better compensation
   - But honestly, a lot of what I read online talks about very long working hours and higher pressure/workload there

Long term I want to stay in advanced packaging/interconnect technologies and maybe eventually move into areas like heterogeneous integration, photonics integration, advanced architectures, etc.

I’m honestly confused about which direction is better for long-term growth.

A few things I’d really like input on:
- Is going deeper into SI/PI a better long-term specialization?
- Or does package design + NPI open broader opportunities later?
- Which path tends to have better stability and growth in the industry?
- How different are the cultures at AMD vs Broadcom in reality?
- If you were early/mid career in this field, which one would you pick and why?

Would really appreciate advice from people actually working in these areas instead of generic internet opinions.

Hi everyone, I’ve been applying for semiconductor roles in Germany for a while now, but haven’t received any positive feedback.

I’m Taiwanese but currently live in Germany. I hold a Master’s degree and have nearly two years of experience as a Process Engineer back in Taiwan. I've applied for Process, Customer Service, and Integration Engineer roles at companies like ESMC, KLA, Lam Research, and GlobalFoundries. I’m fluent in English and currently learning German, aiming to reach B1 by this November.

Is German proficiency a strict requirement for these positions, or should I adjust my CV for the German market? If anyone has tips on improving my application strategy or networking within the industry here, I’d really appreciate your insights!

There is a contract position open at TEL for a field service engineer in Arizona, the position mainly supports the TSMC facility. I have some questions about the company in general and about FSE's. If anyone has experience with TEL or working as a FSE at a similar company, then any input would be great.

1. Does the work culture of the customer effect the work of the vendor? TSMC is notorious for their hard work culture, I wouldn't work for them outright. That being said I have worked with vendors before, and they seem to get a different experience servicing the company rather than working at the company of the customer.
2. Do their contracts end up transitioning to full time positions, or is it just a pipe dream? I have seen companies that transition a lot of their people out of contracts, and I have seen "permanent" contract companies.
3. Working at a vendor company can lead to companies trying to poach you, how much experience could lead to a poaching or another job? If for example I work for 2 years at TEL and don't like it, would I be able to go to another company and find a good job using the experience I gained?

Any other information would be helpful, and appreciated.

Will we see Micron employees in the U.S. get the same bonuses that fab workers at Sk Hynix/Samsung are getting? Like they are getting $900K in South Korea that would go along way in the U.S!

If anyone has done summer internship at SCL Mohali, then please share your experience about the culture, environment, working hours etc. of that place...

Hello everyone,

I am about to start a Master’s degree at Paris-Saclay University in the field of semiconductors. It’s a rather unique programme as it’s an apprenticeship. Even my Bachelor’s degree in physics was completed as an apprenticeship in a front-end fab specialising in thin-film metrology. And I intend to stay in this department for my Master’s apprenticeship.

Given the current state of the semiconductor industry in France, I’m starting to think about potentially moving abroad after I graduate, and I wanted to know whether French qualifications, particularly with five years’ apprenticeship experience, are well regarded overseas. Will I find it difficult to get a job in Europe or elsewhere?

These past 2 months I’ve been contacted by a few recruiters looking to fill positions (experienced hired with semi experience) for 4 different fabs. All of them advertised higher salary and comp than what I get paid, unfortunately I don’t want to move. Last year i was only contacted by 1 recruiter and the comp was similar to my current comp.

Demand for chips has picked up and there’s a lot on new fabs in the process of ramping, I’m guessing there is a shortage of talent with industry experience.

Hopefully that means that the downturn is over and can’t have a decent raise this year

Hi everyone,

I’m currently working as an FSE/TSE in the digital printing industry, and I’m seriously considering transitioning into the semiconductor industry.

My background is mainly in complex industrial equipment: troubleshooting, calibration, preventive and corrective maintenance, customer-site support, system ramp-up, escalations, upgrades, installation support, and working closely with R&D / higher-level support teams when issues are complex or recurring.

I’m interested in semiconductor equipment companies such as ASML, Applied Materials, KLA, Lam Research, Nova, etc., especially roles around field service, system support, system integration, applications, or technical support.

I’d really appreciate insights from people already working in semiconductors, especially FSEs, system engineers, process engineers, applications engineers, or hiring managers.

Some questions I have:

How realistic is the transition from another complex equipment industry into semiconductors?

Is experience with complex machinery, troubleshooting, customer support, and system-level problem solving valued, even without direct semiconductor fab experience?

What are the real expectations for semiconductor FSE roles?

I understand the job can involve long hours, on-call support, cleanroom work, travel, pressure from customers, and strict procedures. What should someone coming from another industry be ready for?

What basic technical knowledge should I build before applying or interviewing?

For example:

Semiconductor manufacturing flow

Lithography, etch, deposition, metrology, inspection

Vacuum systems

Motion control

Optics / lasers

RF / plasma basics

Mechatronics

PLCs / automation

Data analysis / logs (how heavy is it? Considering I'm already using python and Matlab tools for basic analysis and troubleshooting. Every company must have dedicated tools already built and ready to use I guess)

Cleanroom protocols

Which topics are actually useful for an FSE candidate, and which are less important at the beginning?

What skills matter most in interviews?

Is it more about deep theory, structured troubleshooting, safety mindset, customer communication, ability to follow procedures, electrical/mechanical competence, or something else?

What kind of questions should I expect in interviews?

Are they usually technical case studies, behavioral questions, troubleshooting scenarios, semiconductor basics, or practical equipment questions?

What would make a candidate from another industry stand out?

Would experience with machine-down situations, customer escalations, first installs, ramp-up, system calibration, uptime improvement, and collaboration with R&D be relevant?

Are there specific entry points you would recommend?

For example:

Field Service Engineer

Customer Support Engineer

Technical Support Engineer

System Integration Engineer

Applications Engineer

Install Engineer

Equipment Engineer

Which roles are the best bridge into semiconductors for someone with capital equipment experience?

Any recommended resources to study?

Books, courses, YouTube channels, websites, or certifications that would help build the right foundation before applying.

I’m not expecting to become a semiconductor expert overnight, but I want to understand what knowledge and mindset are expected, how to prepare seriously, and how to present my previous experience in a way that makes sense to semiconductor employers. I'm afraid of not passing ATS screening due to my lack of degree/education even though I have up to 7 years of experience ramping up and servicing complex equipment all across EMEA.

Any honest advice, warnings, interview tips, or learning roadmap suggestions would be really appreciated. Especially from people who succeeded to make this shift, from printing industry to semicon.

Thanks in advance.

Hi everyone,

I’m currently finishing my PhD and trying to decide between two semiconductor opportunities in the Bay Area. I’d really appreciate some industry perspective.

Option 1:
Applied Materials – Process Engineer III (Deposition)

Option 2:
Lam Research – Product Engineer III (Etching)

A bit more context:

• Compensation seems fairly similar
• Both are process/productivity-oriented roles
• Long-term, I’m interested in technical growth but also want a sustainable career path

From conversations during interviews:

• Applied team culture seemed more balanced/supportive
• Lam selective etch work seems extremely cutting-edge and high visibility

For people in semiconductor/process engineering:
Which path would you personally choose early in your career, and why?

Thanks!