AMD vs Broadcom
Need some genuine career advice from people in semiconductor packaging/SI-PI roles.
Right now I’m working in an OSAT-type environment where my role is kind of a mix of Advanced Package Design and SI/PI. Over the last few years I’ve worked on things like:
• Advanced package/RDL/substrate design
• High-speed routing
• SI/PI simulations and debugging
• UCIe/LPDDR/HBM related issues
• Package bring-up and coordination with different teams
• A bit of NPI exposure too
The problem is I’m now at a stage where I need to decide whether I want to go deeper into SI/PI specialization or move more toward package design + NPI/program side responsibilities.
I currently have two offers:
1. AMD
• More SI/PI focused role
• Feels more aligned with deep technical work in high-speed/package architecture
• Slightly lower compensation
2. Broadcom
• More package design + NPI focused
• Better compensation
• But honestly, a lot of what I read online talks about very long working hours and higher pressure/workload there
Long term I want to stay in advanced packaging/interconnect technologies and maybe eventually move into areas like heterogeneous integration, photonics integration, advanced architectures, etc.
I’m honestly confused about which direction is better for long-term growth.
A few things I’d really like input on:
• Is going deeper into SI/PI a better long-term specialization?
• Or does package design + NPI open broader opportunities later?
• Which path tends to have better stability and growth in the industry?
• How different are the cultures at AMD vs Broadcom in reality?
• If you were early/mid career in this field, which one would you pick and why?
Would really appreciate advice from people actually working in these areas instead of generic internet opinions.