Galaxy s23 ultra water damage motherboard repair...
I am repairing a water-damaged Samsung Galaxy S23 Ultra motherboard. After removing the rear shield can, I found corrosion and burn marks on almost all IC pads except one. I removed all ICs on the back side, re-balled them, and replaced a faulty IC. When I tried to inject power, there was an immediate short and a component overheated. Even after removing that IC, the same pad area continued to heat up. So I separated the board layers and found that an inductor next to the camera PMIC measured 0 ohms on both sides. I replaced the camera PMIC, and that issue was resolved. After reassembling the layers (using a donor upper board), I powered it again and found the same overheating issue. Reballing the IC at that hotspot fixed the short (VBATTERY_SR line recovered from 0 ohms to normal). Now, when I inject power, there is no visible heat, but a constant current draw of about 0.001–0.002A remains. How can I diagnose this condition?
