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NVIDIA is developing plans for orbital AI data centers to address the growing environmental and infrastructure challenges of Earth-based facilities. Rising energy consumption, cooling demands, land usage, and water shortages have increased concerns over the long-term sustainability of terrestrial AI infrastructure.

The company is collaborating with firms including Starcloud, Planet Labs, Kepler Communications, Firefly Aerospace, and Sophia Space to develop space-based AI systems powered by solar energy and cooled through the vacuum of space.

NVIDIA’s proposed orbital facilities could reportedly deliver significantly lower energy costs than conventional data centers. The company has also introduced its “Space-1 Vera Rubin” AI module, designed specifically for space environments and capable of supporting real-time geospatial analysis, autonomous operations, and satellite-based AI processing.

At the same time, SpaceX and Anthropic are pursuing similar orbital AI infrastructure projects. Despite potential advantages, challenges remain regarding large-scale GPU deployment, transportation logistics, and long-term operational feasibility in space.

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▮[Source]: wccftech.com

Micron has begun sampling 256 GB DDR5 RDIMM memory modules designed for AI servers and high-performance computing systems. The new modules deliver speeds of up to 9,200 MT/s, representing more than a 40% increase compared to current mass-produced DDR5 RDIMMs.

The modules are built using Micron’s 1-gamma DRAM technology and advanced packaging methods, including 3D stacking and through-silicon vias. These technologies improve memory capacity, bandwidth, and power efficiency for demanding AI workloads such as large language models, real-time inference, and high-core-count CPU processing.

Micron stated that a single 256 GB module can reduce operating power consumption by over 40% compared to using two 128 GB modules, helping data centers improve energy efficiency while maintaining higher memory density.

The company is currently working with server ecosystem partners to validate compatibility across current and future server platforms before broader deployment in enterprise AI infrastructure.

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▮[Source]: wccftech.com

Demand for GPUs has increased significantly due to expanding AI infrastructure and data center requirements. The surge in AI-related workloads has created supply shortages across the semiconductor industry, affecting GPUs, CPUs, memory, and wafer production.

NVIDIA stated that even GPUs released four to five years ago are increasing in value as demand continues to outpace supply. Older accelerator models, including the H100, H200, L40S, and A100, remain widely used for AI and compute tasks because of continued software optimizations and platform support.

Cloud computing providers and AI infrastructure companies reported rising prices for both current and previous-generation GPUs on a quarter-over-quarter basis. Many providers also indicated that near-term compute capacity remains largely sold out.

The continued expansion of AI model development and deployment has intensified pressure on hardware manufacturers and cloud providers, contributing to higher prices across the broader technology supply chain.

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▮[Source]: wccftech.com

Maxsun introduced two affordable MoDT (Mobile on Desktop) motherboards featuring integrated Intel Core 200H “Raptor Lake” mobile processors. The new models, MS MoDT 230H D4 WIFI and MS MoDT 205H D4 WIFI, target budget gaming and compact PC builds by combining the CPU and motherboard into a single package.

The higher-end model includes the Intel Core 7 230H with 10 cores, 16 threads, and boost speeds up to 5.2 GHz. The lower-tier version uses the Intel Core 5 205H with 8 cores, 12 threads, and boost speeds up to 4.8 GHz.

Both boards support DDR4 memory, PCIe 5.0, Wi-Fi 6, Bluetooth 5.3, dual M.2 Gen4 slots, SATA III storage, and compatibility with standard LGA 1700/1800 coolers. The compact mATX-based design also includes multiple USB ports and 1GbE networking.

Pricing ranges from approximately $150 to $200, significantly lower than buying separate desktop CPUs and motherboards, making the platform attractive for entry-level and value-oriented PC builders.

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▮[Source]: wccftech.com

Counterfeit DDR5 memory modules are increasingly appearing in Asian PC hardware markets as memory prices continue to rise. Some fake modules imitate major brands such as Samsung and SK Hynix while containing non-functional plastic components instead of real DRAM chips.

Reports indicate that certain counterfeit modules also include incorrect or mismatched power circuitry. Visual inconsistencies such as unusual gold connectors, rounded edges, and mismatched branding have been identified as common warning signs. Desktop memory products with heat spreaders may be more difficult for average buyers to inspect.

Some listings for suspicious DDR5 modules have appeared on online marketplaces in Japan, often sold as unverified or non-returnable items. Counterfeit PC hardware scams have also affected GPUs and CPUs in recent years.

Consumers are advised to purchase components from reputable sellers, verify reviews and listings, and inspect hardware carefully before use.

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▮[Source]: wccftech.com

U.S. authorities are investigating a large-scale smuggling operation involving restricted AI hardware shipped from Thailand to China. Several employees and executives linked to Supermicro are accused of participating in a scheme valued at approximately $2.5 billion. The operation allegedly transferred AI servers containing advanced NVIDIA GPUs to Chinese companies despite U.S. export restrictions.

Investigators stated that Thailand-based OBON Corp and third-party brokers were involved in redirecting servers to Alibaba in China. More than $500 million worth of AI equipment was reportedly moved during April and May 2025, with many systems using NVIDIA H200 accelerators.

Alibaba denied involvement in smuggling activities and stated it has no business relationship with the accused parties. NVIDIA also stated that partners are expected to comply fully with export regulations.

The case highlights ongoing demand in China for advanced AI hardware and the continued existence of gray-market supply channels despite international export controls.

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▮[Source]: wccftech.com

NVIDIA’s upcoming Rubin and Rubin Ultra AI platforms are reportedly facing multiple design and manufacturing challenges ahead of their expected launch. Reported issues include HBM4 memory speed limitations, reduced yields, warpage problems in packaging, power delivery complications, and heat spreader redesigns.

Rubin Ultra is rumored to scale back from a four-die GPU design to a two-die configuration due to manufacturing and packaging constraints. Memory capacity targets have also reportedly been reduced from 1 TB of HBM4E memory to 768 GB using 12-Hi stacks instead of 16-Hi stacks.

The platforms are expected to continue using advanced TSMC CoWoS-L packaging and may rely on board-level assembly to maintain performance targets. NVIDIA is also reportedly revising thermal interface materials and heat spreader layouts after stability and production concerns emerged.

AMD’s MI500 platform, expected in the second half of 2027, is positioned as a direct competitor with advanced packaging, multi-die architecture, and HBM4E memory support. Despite reported setbacks, NVIDIA is still expected to address the issues before mass production.

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▮[Source]: wccftech.com

Apple and Intel have reportedly reached a preliminary agreement for Intel to manufacture some of Apple’s future chips, potentially including the next-generation A21 processors for the MacBook Neo lineup. The move is intended to expand Apple’s production capacity amid rising demand for AI-related hardware and supply constraints affecting advanced semiconductor manufacturing.

Apple currently relies on TSMC for production of its A18 chips using the N3B process. Increased demand for MacBook Neo laptops and iPhone devices has reportedly pressured available chip supply, prompting Apple to diversify manufacturing partners.

Intel’s advanced 18A-related process technologies are considered possible candidates for the production agreement, although no specific manufacturing node has been confirmed. The deal is viewed as a significant opportunity for Intel’s foundry business as it seeks to compete more aggressively in contract chip manufacturing.

The MacBook Neo lineup continues to target the mainstream laptop market, competing directly with x86-based systems from Intel and AMD.

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▮[Source]: wccftech.com

AMD Radeon graphics cards, including the AMD Radeon RX 9070 XT, AMD Radeon RX 9060 XT, and AMD Radeon RX 7650 GRE, are reportedly selling below MSRP in China due to weakening demand and inflated market pricing. Retailers and distributors are said to be facing financial losses as selling prices fall below procurement and operating costs.

The Radeon RX 7650 GRE has seen some of the largest reductions, with prices dropping roughly 24% below its official launch price. The RX 9060 XT 8 GB variant has also experienced declining demand and lower street pricing, while the 16 GB model reportedly maintains stronger sales.

The flagship RX 9070 XT is now selling slightly below its official pricing in some Chinese listings, contrasting with higher prices still observed in regions such as North America and parts of Europe.

Reports indicate that high GPU and VRAM pricing contributed to weaker consumer demand, forcing sellers to reduce prices to recover inventory costs. Market conditions remain volatile, and broader global price reductions are not yet guaranteed.

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▮[Source]: wccftech.com

Gigabyte has launched the AORUS GeForce RTX 5090 Infinity, a custom high-end graphics card based on NVIDIA’s Blackwell architecture. The model includes 32GB of GDDR7 memory, DLSS 4 support, and a factory overclock reaching 2730 MHz, significantly above the reference boost clock.

The card features a compact triple-slot design with a cooling system that visually resembles a dual-fan layout but internally uses three fans. Gigabyte’s new WINDFORCE Hyperburst cooling solution combines Hawk fans, a vapor chamber, superconducting heat pipes, and a dual flow-through airflow design to improve thermal efficiency and reduce noise.

An additional “Overdrive” fan activates under heavier workloads to enhance airflow and sustain maximum performance. The design also incorporates server-grade thermal materials and a metal shroud and backplate for durability.

Gigabyte has not announced official pricing, though estimates place the card between $3,500 and $5,000 based on current RTX 5090 market prices.

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▮[Source]: wccftech.com

NVIDIA CEO Jensen Huang stated that China will not receive the company’s most advanced AI chips, including Blackwell and Rubin, in line with ongoing United States export restrictions on high-end AI hardware. Huang emphasized that the United States should maintain leadership in AI technology, with American firms receiving the “first, the most, and the best” technologies. At the same time, he argued that U.S. companies should continue competing globally to maximize exports, revenue growth, and national security benefits tied to economic strength. NVIDIA confirmed it has not shipped any H200 GPUs to China despite receiving conditional approval tied to revenue-sharing arrangements with the U.S. government. The company’s market presence in China has reportedly declined as domestic firms, including Huawei, expand their AI hardware capabilities and adoption.

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▮[Source]: wccftech.com

AMD reported strong year-over-year growth in its Client and Gaming segment during Q1 2026, with revenue increasing 23% to $3.94 billion. Growth was driven by strong sales of Ryzen desktop and laptop processors, including Ryzen 9000X3D and Ryzen AI products, alongside increased adoption by major OEM partners such as Dell, HP, and Lenovo.

Despite positive momentum, the company expects PC and gaming demand to weaken during the second half of 2026. AMD attributed the expected slowdown to rising memory and component prices caused by increasing AI-related demand across the data center sector.

Gaming revenue declined 15% sequentially, and AMD forecasts gaming revenue in the second half of the year to fall by more than 20% compared to the first half. Higher costs are also expected to affect console pricing, including PlayStation 5 and Xbox Series systems.

AMD stated that memory supply remains constrained industry-wide but confirmed it has secured sufficient supply through partnerships with memory vendors.

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▮[Source]: wccftech.com

AMD reported record Q1 2026 revenue of $10.3 billion, marking a 38% year-over-year increase driven primarily by demand for AI infrastructure, EPYC server processors, and Instinct accelerators. The Data Center segment generated $5.8 billion in revenue, up 57% annually, while the Client and Gaming segment reached $3.6 billion, supported by Ryzen processor and Radeon GPU sales.

The company stated that growing adoption of inferencing and agentic AI workloads is increasing demand for high-performance server CPUs. AMD also reported strong enterprise and cloud adoption, with EPYC-powered cloud instances surpassing 1,600 globally.

AMD highlighted upcoming sixth-generation EPYC Venice processors based on the Zen 6 architecture and TSMC’s 2nm process technology. The company also confirmed development of Verano, a future EPYC CPU designed specifically for AI infrastructure workloads.

AMD expects the server CPU market to exceed $120 billion by 2030, citing rapid AI-driven growth and increased compute requirements across cloud and enterprise environments.

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▮[Source]: wccftech.com

AMD’s upcoming Ryzen AI MAX+ 495 “Gorgon Halo” APU has surfaced in benchmark leaks, indicating a next-generation flagship design with enhanced performance and expanded memory capacity.

The processor is reported to feature 16 Zen 5 CPU cores with 32 threads, alongside a Radeon 8065S integrated GPU based on RDNA 3.5 architecture. It maintains similar cache configurations to prior models but operates at improved clock speeds. The platform tested includes up to 192 GB of memory and high-capacity storage, suggesting suitability for demanding workloads such as large-scale AI processing.

Benchmark results show approximately 10% higher multi-threaded performance and modest single-threaded gains compared to its predecessor. GPU performance appears comparable to earlier variants, indicating incremental improvements rather than major architectural changes.

The Ryzen AI MAX 400 “Gorgon Halo” series is expected to launch in late 2026 or early 2027.

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▮[Source]: wccftech.com

Intel’s Arc Pro B70 32 GB graphics card has been evaluated in gaming and AI benchmarks, demonstrating notable performance improvements over the Arc B580 and competitive results against the RTX 5060 Ti 16 GB.

The GPU is based on the Battlemage BMG-G31 architecture, featuring 32 Xe2-HPG cores, 256 XMX engines, 32 ray tracing units, and 32 GB of GDDR6 memory on a 256-bit interface, delivering 608 GB/s bandwidth. It is primarily designed for professional and AI workloads.

In 1440p rasterized gaming, the Arc Pro B70 achieves up to 40% higher performance than the Arc B580 and shows mixed results against the RTX 5060 Ti, sometimes leading and sometimes trailing. In ray tracing, it outperforms the B580 by up to 65% and competes closely with the RTX 5060 Ti.

AI benchmarks indicate superior token throughput and faster response times compared to the RTX 5060 Ti. The results suggest that a gaming-focused variant could have offered strong mid-range competition, though such a release is unlikely due to memory supply constraints.

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▮[Source]: wccftech.com

xAI reportedly utilizes only about 11% of its approximately 550,000 NVIDIA GPUs, indicating significant inefficiencies in its AI infrastructure. The deployed hardware, including H100 and H200 GPUs across large-scale clusters, operates far below capacity, with effective usage equivalent to roughly 60,000 GPUs.

The low utilization is attributed to software stack limitations and challenges in scaling distributed systems. As GPU clusters grow to hundreds of thousands of units, inefficiencies in coordination, data pipelines, and workload distribution increase, leading to higher idle time.

This issue is not unique to xAI but reflects broader industry challenges in achieving efficiency at scale. In comparison, companies such as Meta and Google report higher utilization rates, reaching approximately 43–46%, due to more mature software optimization.

xAI aims to improve utilization to around 50% through infrastructure and software enhancements, alongside potential expansion into GPU rental services and future AI-focused hardware development.

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▮[Source]: wccftech.com

Testing indicates that ASUS’s ROG Equalizer 12V-2×6 cable does not achieve the intended load balancing performance. Independent evaluation using an RTX 5090 and monitoring tools revealed uneven current distribution across pins, sometimes performing worse than standard cables. Variations were observed with repeated reconnections, with differences reaching up to 4A between pins.

The issue is linked to the cable’s internal design. A built-in electrical bridge introduces additional resistance, contributing to imbalance. When this bridge was removed, current distribution improved significantly, reducing disparity between pins.

Additional drawbacks include increased cable stiffness, limiting flexibility and requiring more installation space. The use of gold-plated pins, compared to the commonly used tin-plated connectors on GPUs, may also lead to reduced compatibility and potential long-term wear or oxidation risks.

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▮[Source]: wccftech.com

A leaked benchmark listing indicates that AMD may introduce the Ryzen 9 PRO 9965X3D, its first professional desktop processor featuring 16 cores based on the Zen 5 architecture and equipped with 3D V-Cache.

The Ryzen PRO series, typically designed for professional workloads, emphasizes security, manageability, and efficiency. Previous models in this lineup were limited to a maximum of 12 cores, making this a notable expansion in core count.

Preliminary benchmark data suggests the processor performs slightly below the standard Ryzen 9 9950X3D, with minor reductions in single-threaded and multi-threaded performance. This difference is likely due to a lower power consumption target, as PRO variants commonly operate at reduced thermal design power levels.

Uncertainty remains regarding final specifications, particularly power consumption and cache configuration, as conflicting reports indicate both 65W and 170W variants. The processor’s official specifications and release details have yet to be confirmed.

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▮[Source]: wccftech.com

Apple has discontinued the base variant of the Mac mini featuring the M4 chip, 16GB of RAM, and 256GB of storage. The model has been removed from official sales channels in major global markets after orders were halted earlier.

The decision follows ongoing supply constraints affecting Mac mini and Mac Studio devices. Limited availability of advanced semiconductor nodes has been identified as a primary bottleneck, while rising memory costs are expected to significantly impact operations in the near term.

Higher-tier configurations, such as models with 512GB storage, remain available. Demand for these systems has increased, driven in part by growing interest in edge AI workloads supported by unified memory architecture.

Inventory shortages have also been linked to upcoming product transitions, with newer chip versions anticipated. Meanwhile, secondary markets have seen inflated prices for high-end configurations due to constrained supply and strong demand.

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▮[Source]: wccftech.com

Microsoft indicates that 16 GB of RAM is now considered a baseline for gaming PCs running Windows 11, rather than a recommended standard. While still functional, this capacity may involve performance compromises, particularly when running modern games alongside background applications.

The company identifies 32 GB of RAM as a more suitable “no worries” configuration, offering improved performance and better future-proofing. Increased memory allows games and applications to operate more smoothly, especially as software demands continue to grow.

Background processes such as web browsers and communication tools can significantly increase memory usage, limiting available resources for primary tasks. Higher RAM capacity helps mitigate these limitations.

Additionally, Microsoft recommends using solid-state drives (SSDs) instead of hard disk drives (HDDs) for operating systems and games. SSDs provide faster load times and improved system responsiveness, while HDDs are better suited for bulk storage.

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▮[Source]: wccftech.com